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Product Summary of Lost Carbonate Sintering (LCS) Porous Copper Foam

Goodfellow is delighted to announce the addition of an exciting new product to our range – LCS copper foam.

What is LCS Copper foam?

Unlike the copper foams we have had in our catalogue for several years, which are a permeable structure of cells and continuous ligaments with pore sizes of 4 to 16 pores /cm (10 to 40 PPI) and a relative density of around 9%, this new foam has much smaller pores (300 to 600µm) and a relative density of around 37%. This gives it a much higher surface area.

New LCS Copper Foam

Traditional Copper Foams from Goodfellow

Properties

CHARACTERISTICS

New LCS Copper Foam

Other Copper Foams available from Goodfellow

Material

Copper 99.7%

Copper 99.9%

Standard catalogue sizes

5mm thick x 50mm x 64mm

10mm thick x 50mm x 64mm

4mm thick x 23mm diameter

(other sizes on request)

6.35mm thick x 150mm x 150mm

 (other sizes on request)

Standard cladding

None

None

Cladding thickness

Not applicable

Not applicable

Standard cell size

300 to 600µm

10 to 20 pores/cm (25 to 50 PPI)

4 to 16 pores/cm (10 to 40 PPI)

Other available cell sizes

200 to 300µm, 630 to 1000µm

2 pores/cm (5 PPI)

Foam topology

Randomly distributed, interconnected pores

Randomly distributed, interconnected pores

Relative density

37%

5 to 12%

Nominal density

3.32 g/cm3

0.45 to 1.08 g/cm3

Relative surface area

24 mm2/mm3 (24000 m2/m3)

200 to 2000m2/m3

Maximum service temperature

1080°C

1080°C

Compression strength

-

0.903 MPa‡

Tensile strength

13 MPa

6.9 MPa‡

Modulus of elasticity

22 GPa (tension)

736 MPa‡

Shear modulus

9 GPa

282 MPa‡

Specific heat

385 J/kg.K

385 J/kg.K

Bulk thermal conductivity

7 to 43 W.m-1.K-1

10.1 W.m-1.K-1

Coefficient of thermal expansion

16.5 µm.m-1.K-1

16.5 µm.m-1.K-1 ‡ (20 to 100°C)

Bulk resistivity

2.8 * 10-8 to 1.66 * 10-7 ohm-cm (at 20°C)

6.5 * 10-5 ohm-cm ‡

‡ at 8% nominal density

Uses

  • Liquid cooling
  • Air cooling
  • Heat exchangers
  • Board level electronics cooling
  • Power electronics

as well as

  • EMI shielding
  • Impact absorption
  • Acoustic dampening
  • Supporting catalytic reactions
  • Filtration

Production process

Pure copper powder is mixed with a carbonate powder and compacted. It is then sintered, heating it enough to make the particles of copper powder bond to each other without melting. This forms a matrix of copper ligaments, in between which is the carbonate powder. After cooling the carbonate is either dissolved away in water and recycled or decomposed using heat.

The carbonate is chosen to have a decomposition temperature higher than the melting point of copper, and can be one or more of a range of widely available carbonates such as calcium, magnesium, potassium or sodium carbonate. The precise choice of carbonate is influenced by the melting point, the size of the particles and their solubility in liquids.

  1. Copper particles are mixed with carbonate particles

  2. The mixture is compacted to shape

  3. The mixture is heated to a temperature of approximately 1000°C, causing the copper to bond.

  4. The carbonate particles are thermally decomposed or dissolved away. The product is then finished and passed to Quality Control.

Please click here to see catalogue sizes and availability.